No deformation happen during hot stampling process,fast temperature rise,the hot stamping rate is more than 120000 times.
Halftone screen “9” is OK to obtain a correct exposure. For fine form, “11” is enough.
400-600mJ/cm2 is required for exposure.
Put the exposed plate into 1% sodium hydroxide (NaOH) aqueous solution for 8-10 seconds, or into 5% sodium carbonate (Na2CO3)
aqueous solution or Hydro-Solve developer concentrate for 1 minute, in temperature 300C,then take out the plate from the solution,
wash and wipe it with sponge in clean water softly.
Repeat above step to develop again if the plate is not clear enough.
Then dry it with compressed air or by absorbent paper.
A faster developing will happened while the solution was heated.
Touch it if necessary, no “Burn-in” is needed.
Record the weight in log.
Put the plate into 3% Nitric acid (HNO3) aqueous solution in room temperature and brush it lightly, then wash it with clean water.
To prevent oxidation, uniformly wet the plate immediately with Express Guard plate protector or Arabic gum aqueous solution before
clamping it on the lid of the etchin machine.
Follow the instructions by the machine producer to etch the plate.
Bath formula: Nitric Acid 41.8oBe’ 19% by volume
etch Additive 4% by volume
water 77% by volume
Machine data: paddle Depth 8-10mm
paddle speed 380 rpm
starting temperature 28oC
plate holder 6-8 rpm
Etching speed: 1mm per 7 minutes for a new bath
The paddle speed and starting temperature should be adjusted according to the variety of the sidewall in the following etching process.
After etching, wash the plate with water or tri-sodium phosphate aqueous solution, then dry it.
Weight the plate to calculate the magnesium dissolved, then replenish Nitric acid accordingly, about 160ml Nitric acid corresponding
1 ounce of magnesium. Do not forget to check the dip gauge.
Soak the plate in a 10% sodium hydroxide (NaOH) aqueous solution or in top remover concentrate solution in temperature 30OC
about 3 minutes, then remove and brush it with water.
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